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talkN. Kockmann, T. Kiefer, M. Engler, P.Woias

Statische Mikromischer für chemische Reaktionen

VDI/VDE Mikrosystemtechnik Kongress (P2-37), 10.-12.10.2005, Freiburg, DE

talkM. Engler, T. Kiefer, N. Kockmann, P. Woias

Schnelle konvektive Mikromischer mit hohem Durchsatz für die chemische Produktion

VDI-GVC/DECHEMA Jahrestagung (P1-12), 06.-08.09.2005, Wiesbaden, DE

talkN. Kockmann, T. Kiefer, M. Engler, P.Woias

Channel networks for optimal heat transfer and high throughput mixers

ESI Int. Conf. Heat Transfer and Fluid Flow in Microscale09.2005, Il Ciocco, ITA

talkM. Engler, T. Kiefer, N. Kockmann, P. Woias

Efficient High-Throughput Micromixers for Production Purposes

Int. Conf. Commercialization Micro Nano Systems (COMS), 21.-25.08.2005, Baden-Baden, DE

talkN. Kockmann, M. Engler, P. Woias

Fouling processes in micro structured devices, ECI Heat Exchanger Fouling and Cleaning: Challenges and Opportunities

ECI Symposium, 05.-10.06.2005, Kloster Irsee, DE, http://services.bepress.com/eci/heatexchanger2005/28

talkN. Kockmann, T. Kiefer, M. Engler, P.Woias

Convective Mixing and Chemical Reactions in Micro Channels with High Flow Rates

IEEE Transducers 05, 13th Int. Conf. Solid State Sensors, Actuators and Microsystems, 05.-09.06.2005, Seoul, KOR, EA363

talkR. Wengeler, M. Heim, M. Wild, H. Nirschl, G. Kaspar, N. Kockmann, M. Engler, P.Woias

Aerosol particle deposition in a T-shaped micro mixer

ASME-ICNMM 2005, 22.-25.05.2005, Toronto, Canada, 10.1115/ICMM2005-75199

talkN. Kockmann, T. Kiefer, M. Engler, P.Woias

Silicon microstructures for high throughput mixing devices

ASME-ICNMM 2005, 22.-25.05.2005, Toronto, Canada, 10.1115/ICMM2005-75125

talkN. Kockmann, M. Engler, T. Kiefer, P. Woias

Konvektives Mischen in Siliziumstrukturen mit hohem Durchsatz

VDI-GVC-Fachausschusssitzung "Mischvorgänge", 18.-19.04.2005, Paderborn, DE

talkM. Engler, T. Kiefer, N. Kockmann, P.Woias

Effective Mixing by the Use of Convective Micro Mixers

AIChE Spring Meeting IMRET804.2005, Atlanta, USA, TK001 -128d

talkN. Kockmann, P.Woias

Separation Principles in Micro Process Engineering

AIChE Spring Meeting IMRET804.2005, Atlanta, USA, TK002 -129a

talkN. Kockmann

Prozesse und Apparate in der Mikroverfahrenstechnik

VDI-Seminar, Friedrich-Schiller-Universität Jena, Technische Chemie, 20.01.2005, Jena, DE

proceedingR. Wengeler, M. Heim, M. Wild, H. Nirschl, G. Kaspar, N. Kockmann, M. Engler, P.Woias

Aerosol particle deposition in a T-shaped micro mixer

ASME-ICNMM 2005, 2005, p. 323-328, 10.1115/ICMM2005-75199

proceedingN. Kockmann, T. Kiefer, M. Engler, P.Woias

Silicon microstructures for high throughput mixing devices

ASME-ICNMM 2005, 2005, p. 303-308, 10.1115/ICMM2005-75125

journalN. Kockmann, M. Engler, D. Haller, P. Woias

Fluid dynamics and transfer processes in bended microchannels

Heat Transfer Eng., 2005, vol. 26, p. 71-78, 10.1080/01457630590907310

journalM. Engler, T. Kiefer, N. Kockmann, P. Woias

Schnelle konvektive Mikromischer mit hohem Durchsatz für die chemische Produktion

Chem. Ing. Tech., 2005, vol. 77, p. 992-993, 10.1002/cite.200590084

journalN. Kockmann, M. Engler, P. Woias

Fouling processes in micro structured devices

ECI Heat Exchanger Fouling and Cleaning, 2005, p. 191, http://services.bepress.com/eci/heatexchanger2005/28

talkM. Engler, N. Kockmann, T. Kiefer, P. Woias

Convective mixing and its application to micro reactors

ASME-ICNMM 2004, 17.-19.06.2004, Rochester NY, USA, 10.1115/ICMM2004-2412

talkN. Kockmann, M. Engler, D. Haller, P. Woias

Fluid dynamics and transfer processes in bended micro channels

ASME-ICNMM 2004, 17.-19.06.2004, Rochester NY, USA, 10.1115/ICMM2004-2331

talkM. Engler, N. Kockmann, P. Woias

Konvektives Mischen in statischen Mikromischern unterschiedlicher Geometrien

GVC-Fachausschusssitzung "Mischvorgänge" und "Technische Reaktionsführung", 16.-17.03.2004, Weimar, DE

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